Mainly used in the field of consumer precision electronics, including processes such as dust-catching gluing, prism gluing, Holder Bond, Lens shading gluing, enameled wire welding for VCM and solder joint protection gluing in the CCM field, Tuffy gluing in the screen display field, MiniLED Chip Coating, Underfill in the SMT field, Component Coating, 3D mobile phone middle bezel dispensing in the FATP field and VR/AR middle bezel dispensing