Home
About Mingseal
Company Profile
Mingseal Culture
Industry Application
Integrated Circuits
Discrete Components
Consumer Precision Electronics
Intelligent Automotive Electronics
Product Series
Automation Line
Process Equipment
Process Module
Sevice Support
Sevice Network
Contact Us
Industry Application

SEMICONDUCTOR

Integrated Circuits

Mainly used in the field of integrated circuit packaging, including wafer-level package (WLP), panel-level package (PLP), flip-chip ball grid array (FCBGA), flip-chip chip scale package (FCCSP) and system-in-package (SiP), etc. Including processes such as Underfill, Dam & Fill, Flux Spray, Solder Paste Painting and Lid Attach.

Customers
Recommended Products