Equipment Front End Module System - Automation Line - Changzhou Mingseal Robot Technology Co., Ltd.

Equipment Front End Module SystemEFEM

The equipment front end module is mainly used to realize automatic supply and unloading of wafers for semiconductor equipment, reduce production costs, improve production efficiency, while ensuring process accuracy and purification requirements. The system has automatic wafer scanning, automatic transfer and automatic calibration functions, can be provided with ID Reader (front and back) according to customer needs, and can be customized based on wafer size, magazine quantity and aligner type, etc. With independent integration, the Company is committed to providing various wafer handling automation system solutions for customers in the semiconductor industry.

The equipment meets the needs of the semiconductor industry, is compatible with international semiconductor communication protocols, supports SECS/GEM communication modules, and matches the information management requirements and unmanned management trends.

System Composition

Wafer Loading System (Loadport)
Wafer Transfer Robot (Robot)
Wafer Aligner (Aligner)
Reading Module (OCR)
Wafer Preheating

Features and Advantages

Damage-free automatic handling of wafers in magazines and between magazines.

Optional Bernoulli fingers for thinning wafers.

Customized production to meet customer needs.

Meeting customers’ needs for multiple/different types of magazines and transfer of wafers with different sizes.

Provided with automatic opening mechanism for magazines.

Provided with efficient filtering device (HEPA specification).

ESD protection meeting international IEC and ANSI standards.

Supporting semiconductor-related automation protocols.

Optional OCR module for Wafer ID, which can deal with barcodes, QR codes, numbers and letters.

Application Cases

Fully-Automatic Wafer Dispensing System

Main System Composition

❶ Loadport&Foup ❷ Aligner ❸ Code scanning station ❹ Preheating station ❺ Heat dissipation station ❻ Dispensing machine ❼ Dispensing machine ❽ Manipulator handling module

主体系统构成

Case Description:

The EFEM mainly performs wafer pre-processing and transfer for wafer-level dispensing machines, and is compatible with 8-inch/12-inch products and mainstream dispensing equipment in the market. It can realize functions such as automatic wafer handling, alignment, preheating, operation heating and heat dissipation. It is compatible with international semiconductor communication protocols, and is provided with an AMHS automatic loading & unloading robot interface to match the information management requirements and unmanned management trends.

Serial Flip-Chip Reflow Operation

Main System Composition

❶ Loadport&Foup ❷ Aligner+OCR ❸ Manipulator handling module ❹ Conveyor track

10.26 铭赛画册_11

Case Description:

The system is suitable for serial operation of flip-chip reflow equipment, and integrates automatic wafer loading & unloading and flip-chip reflow operations. It can realize functions such as automatic wafer handling, alignment, wafer ID reading, and product transfer between different devices. It is compatible with international semiconductor communication protocols, and is provided with an AMHS automatic loading & unloading robot interface to match the information management requirements and unmanned management trends.