Ultra-precision Water Jet Guided Laser Machining Systем MLS300

The MLS300 ultra-precision water jet guided laser machining system, self-developed and manufactured by Mingseal, enables micro-precision processing with accuracy within ±10μm on materials of various thicknesses and hardnesses, including ceramic substrates, liquid metals, wafers, diamond heat sinks, silicon carbide, and more.

Features & Advantages

Adapt various hard and high-value material processing

It is capable of ultra-precision processing on fragile materials such as ceramic substrates, wafers, and thin alloy sheets, as well as handling hard materials like silicon carbide(SiC), boron nitride(BN), carbon fiber (CF), and diamond, with a cutting depth-to-width ratio exceeding 30:1.
Smooth and burr-free cutting surface, no need for grinding or polishing

High-precision jetting angle auto-calibration system combined with ±0.2MPa water pressure control for superior cutting flatness.
Minimize losses of high-value materials
The minimum cutting kerf can reach to 25μm, effectively reducing the waste of materials.
Preserve the original material properties
Stable water flow dissipates heat in real time, keeping the heat affected zone < 5μm.
Avoid cross-contamination of materials
By adopting non-contact processing, the system eliminates mechanical stress and effectively prevents material wear and cross-conta caused by direct contact.
Greater environmental sustainability and safety
No dust or harmful gases are generated during processing, while the water flow directly washes away debris to keep the work piece clean.
Compliance guarantee
CE certified and compliant with SEMI S2 safety standards.

Cutting Surface Display

Carbon-based Diamond
Copper-based Diamond
Boron Nitride
Alumina Ceramic

Technical Principle

Principle of Laser Signal Transmission:

When a laser beam is focused into a micro-scale water jet and travels toward the water-air interface, total internal reflection occurs if the incident angle is smaller than the critical angle, allowing the laser to be efficiently guided forward within the water column.

Based on this principle, by precisely controlling the focal spot size and incident angle, the laser energy can propagate stably and accurately along the water jet, enabling high-quality, high-efficiency processing on the material surface.

Application Fields

Aerospace
Advanced Medical Devices
New Energy
Carbon Fiber Fabric
Integrated Circuits
3C Electronics
Precision Instruments
Diamond

System Composition

In Comparison with Conventional Laser Processing

Class	Water Jet Guided Laser Illustration	Consistent Laser Illustration	Ultrafast Laser Illustration
Heat Affected Zone	≤5μm	>500μm	≤5μm
Cutting Depth-to-width Ratio	≥30:1	10:1	20:1
Min. Kerf	25μm	>100μm	50-100μm
Cutting Taper	Basically no taper	Obviously	Thickness≤0.3mm no taper basically Thickness>0.3mm obvious taper
Cutting Burr	Burr-free, no need for grinding and polishing	Obvious burrs, need grinding and polishing	Thickness≤0.3mm burr-free Thickness>0.3mm obvious burr
Cleanliness	Auto debris removal by water flow, keeping the work piece clean	Post-process surface cleaning required (heavy dust / slag residue)	Post-process surface cleaning required (slight dust residue)
Environmental Friendliness	No dust or hazardous gases	Generate dust and hazardous gases	Generate dust and hazardous gases