Mingseal Technology is deeply engaged in the R&D of precision fluid control and high-end equipment. Adhering to a product strategy of vertical integration across core components, mainframe equipment, and automated production lines, the company focuses on optoelectronic packaging scenarios for silicon photonic PICs and various optical and electrical chips, silicon photonic modules, conventional high-speed optical modules, and CPO optical engines. We provide complete process solutions covering precision dispensing, precision placement, and ultra-precision water-jet-guided laser processing, empowering stable and reliable mass production in optoelectronic manufacturing.
High-speed optical module packaging faces significant challenges, including stringent positioning accuracy requirements, complex process types, and difficulties in controlling batch-to-batch consistency. Processes such as underfill dispensing for optical devices, FA adhesive replenishment, thermal adhesive dispensing, dust-cover dispensing & placement, and EMI shielding edge-sealing for housings impose extremely high demands on equipment motion accuracy, fluid control, and multi-valve compatibility.
At this year's expo, Mingseal Technology will unveil two dedicated solutions for the optical module sector — the FS600S Underfill Dispensing Machine and the FS700S Inline Vision Dispensing Machine — specifically engineered for the underfill dispensing processes of SiP and high-speed optical modules.
The FS600S focuses on underfill dispensing for SiP and high-speed optical modules. Targeting core chips such as silicon photonic PICs, DSPs, and TIAs, it achieves low void rates in the underfill of optoelectronic chips through precise adhesive control. The FS700S features an integrated architecture compatible with a 3D line-scan vision module, with a working stroke supporting a maximum product size of 350×280 mm. It covers the same packaging targets as the FS600S, including high-speed optical modules, optical engines, and chip assemblies. Leveraging its 3D line-scan capability, the FS700S performs actual workpiece height measurement, dynamically compensates dispensing volume based on measured height, and enables post-dispensing adhesive height inspection — forming a closed loop of "measurement–dispensing–inspection." It is adaptable to a wide range of processes, including underfill, FA adhesive replenishment, and lens reinforcement.
In addition, Mingseal Technology offers several other core dispensing solutions:
The FS200A Dual-Station Vision Dispensing Machine features a dual-valve independent module with a multi-head, high-speed, high-precision architecture. It is suitable for packaging, reinforcement, and bonding processes of components such as CCM/VCM and FPC.
The PD500D Five-Axis Linkage Dispensing Machine delivers spatial circular interpolation capability for three-dimensional dispensing on irregularly shaped components. It is well suited to complex 3D coating applications on optical device housings and VR/AR optical assemblies.
The AC100 Precision Dispensing & Placement Machine integrates an all-in-one process flow of dispensing inspection, component placement, and pre-curing. It supports both dispense-then-place and place-then-dispense sequences, enabling fully automated precision assembly of packages and optical module assemblies, and enhancing production line integration.
The VS Series Benchtop Vision Dispensing Machine is equipped with a servo-ground ballscrew module, delivering a comprehensive dispensing accuracy of ±0.025 mm. It offers optional 360° rotation and tilt-rotation modules, and integrates glue AOI inspection along with a dual-mode suction-and-blow automatic adhesive cleaning system to prevent adhesive stringing. It is suitable for optical module thermal management and electromagnetic shielding applications, while also covering a wide range of dispensing processes for VCM, CCM, FPC, and acoustic components.
Water-jet-guided laser technology offers a brand-new pathway for machining hard and brittle materials in optical communications. Optical communication systems rely heavily on highly hard and brittle materials such as ceramic substrates, silicon carbide, and diamond, which are prone to thermal damage and micro-cracks under conventional machining methods. The MLS300 Ultra-Precision Water-Jet-Guided Laser Processing System is equipped with a self-developed water-jet-guided laser coupling head, achieving ultra-precision machining at ±10 μm, with a heat-affected zone of ≤5 μm and smooth, burr-free cut surfaces. It effectively eliminates the thermal damage issues associated with dry laser processing, providing a reliable solution for the precision machining of optical communication heat-dissipation substrates, ceramic components, and optical assemblies.
In the field of core fluid control, Mingseal Technology will also present a complete range of self-developed core components, with a highlight on the KDC Series Precision Dispensing Controller. It achieves automatic precision regulation of both positive-pressure dispensing and negative-pressure suction-back, with an output pressure range of 0.005–0.7 MPa, flexibly covering dispensing and coating requirements for low-, medium-, and high-viscosity fluids. Featuring intelligent monitoring and production-line integration, it provides stable and reliable fluid control for optical communication dispensing processes. The full range of valves will also be on display, including piezoelectric jet valves, screw valves, spray valves, and piston valves, covering the complete fluid control spectrum from micro-dosing to high-flow coating.
Date: September 9–11, 2026
Venue: Shenzhen World Exhibition & Convention Center (Bao'an)
Booth No: Hall 10, Booth 10B26
