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Piezoelectric Valve Jetting SystemPJS

It can be widely used for non-contact dispensing operations in such fields as semiconductor packaging and mobile electronic equipment assembly. It can be used with dispensing machines or automatic production lines to achieve high-speed continuous and long-term production and greatly reduce customer costs.

Features and Advantages Features and Advantages

With nozzle calibration function, the nozzle sleeve can be replaced within 1 minute, and the glue amount accuracy can be controlled within ±2% (depending on different glues)

The nozzle and tappet structure design is more optimized; in combination with smooth trapezoidal wave control technology, the glue scattering rate is <0.5% to achieve good bubble control.

With unique structure and control design, the minimum dispensing diameter of 0.2mm can be achieved, dispensing can be done in a narrow gap of 0.1mm, and the minimum dot volume can be up to 0.5nL.

The parameters can be quantified and the adjustment is simple and convenient, so that it can be used widely.

It can be integrated with various dispensing systems to achieve high output and high consistency.

With modular design, special glue such as anaerobic glue and hot melt glue can be jetted after corresponding modules are replaced or added.

Consumables and usage costs can be reduced effectively.

Application Fields Application Fields

  • Acoustics
  • Optics
  • Medical
  • New Energy Battery
  • Semiconductor
  • Automotive Electronics
  • Flexible Circuit Board
  • Display Screen

Typical Applications Typical Applications

  • Wafer Level Packaging
  • Corner and Edge Connection
  • Package on Package (PoP) Underfill
  • Flip Chip (FC ) Underfill
  • Surface Mount
  • Voice Coil Motor (VCM) and Vibration Motor
  • Ball Grid Array (FC BGA) and Chip Scale Packaging (FC CSP) Underfill
  • Compact Camera Module (CCM)
  • Dam & Fill
  • Micro Speaker and Micro Receiver
  • High-Density Printed Circuit Board (PCB) Underfill
  • Conductive Epoxy Resin

Applicable Fluids Applicable Fluids

  • Epoxy Glue
  • Silica Gel
  • Silver Glue
  • UV Glue
  • Corrosive Glue
  • Ink
  • PUR Adhesive
  •  Flux 
  •  Red Adhesive