Features and Advantages
High thermal dissipation & multi-scenario capability Support high heat dissipation processes, including
thermal grease, indium sheet, flux-free indium sheet,
attaching graphene, diamond,composite diamond, etc.
Matches various dispensing valves such as piezoelectronic
valves, screw valves, Flux Spary valves, and two-component metering valves, supporting versatile process
options.
High efficiency Whole Line equips with independent dual-station and dual-track module, realizing high UPH.
High development Can carry tilt rotation valve configuration, supporting CРО component dispensing.
Large-Size Capability Support dual-track boat 340*340mm dispensing, mounting Ring or LID 150*150mm, meet large-size chip
requirement.
Support large PKG size FCBGA, Q-Panel joint process, and
3T thermal compression capability;
Support TCB mounting head configuration, bond flux-free
indium sheet directly with rapid heating and cooling, no
need for waiting thermal compression;
Support TCB bonding head mode to directly bond chips
with copper or composite diamond materials, effectively
reducing interfacial thermal resistance.
Support motor lifting flexible operation, adapt with glass
substrate process flexible operation
Application Fields
Application Scenarios
| Main Scenarios | Configuration |
| Thermal Grease (TIM) | Load—AD—Tim—Lid Attach—SnapCure—Unload (Basic Configuration) |
| Indium sheet manufacturing process with Flux | Load—Flux Spray—Indium Attach—Flux Spray—AD—Lid Attach—SnapCure—Unload (Basic Configuration) |
|
Load—Coating—Cure—AOI—Flux Spray—Indium Attach—Flux Spray—AD—Lid Attach—SnapCure—Unload (With Passive Component Dam & Fill) |
|
|
Partial Line Mode: Partial Line ①Load—Coating—Cure—AOI + Partial Line ②Flux Pray—Indium Attach—Flux Pray + Partial Line ③AD—Lid Attach—SnapCure—Unload |
|
| Indium sheet manufacturing process without Flux | Load—Indium Attach (3rd Generation Indium)—TCB Mode Lid Attach (Rapid Thermal Melting)—Unload (Basic Configuration) |
| Graphene Thermal Pad | Load—Film TIM Graphene Attach—Lid Attach—SnapCure—Unload |
| Diamond, Copper Composite Material (Gold Platable) | Load—Liquid Metal Thermal Interface Material—TCB Mode Lid Attach (Rapid Thermal Melting)—Unload |
Technical Specification
| Category | Item | Specification |
| Cleanliness Level | Cleanliness of working area | Class 100 |
| Transmission System | Transmission System |
X/Y: Linear motor Z: Servo motor&Screw module |
| Repeatability (3sigma) | X/Y: ±0.005mm Z: ±0.005mm | |
| Positioning Accuracy (3sigma) | X/Y: ±0.010mm Z: ±0.010mm | |
| Max. Speed | X/Y: 1500mm/s Z: 500mm/s | |
| Max. Acceleration | X/Y: 1.5g Z: 0.5g | |
| Grating Resolution | 0.5μm | |
| Core Components | Laser Sensor Accuracy | ±1μm |
| Electronic Weighing Accuracy | 0.01mg | |
| Mark Camera | Resolution: 2500W Pixel: 8μm/pixel | |
| Independent Full Inspection Camera |
Resolution: 2500W Pixel: 8μm/pixel View: 4040mm |
|
| Glue Control System | Match piezoelectric valves, screw valves, FLUX SPRAY valves, two-component metering valves, etc, supporting versatile process options. | |
| Process Capability | System Configuration | Dual Independent Dispensing Valves, Height Measurement, Weighing, and Camera Systems |
| Track Configuration | Dual Tracks | |
| Track Dimension | Support boat size 340340mm | |
| General Condition | Footprint (W×D×H) | 830016002100mm |
| Weight | 1300kg |